mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 1 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 precision wide terminal thin film chip resistors mcw 0406 at precision wide terminal resistors are the perfect choice for most fields of modern professional power measurement electronics where reliability, stability, power dissipation, and robust design is of major concern. beside extremely high power ratings, the mcw 0406 at is characterized by extraordinary temperature cycling robustness, verified th rough extensive testing. ? the permissible power rating is specified with 250 mw. typical applications include power electronics in automotive and industrial appliances. features ? rated dissipation p 70 up to 250 mw ? resistance range down to 1 ? ? superior temperature cycling robustness ? operating temperature up to 155 c ? advanced sulfur resistance verified according to astm b 809 ? superior moisture resistivity ? aec-q200 qualified ? material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 applications ? automotive ? industrial ? high power applications note (1) please refer to application information, see next page. technical specifications description mcw 0406 at imperial size 0406 metric size code rr1016m resistance range 1 ? to 100 k ? resistance tolerance 0.1 % temperature coefficient 15 ppm/k; 25 ppm/k rated dissipation p 70 (1) 0.25 w operating voltage, u max. ac rms or dc 50 v permissible film temperature, ? f max. (1) 155 c operating temperature range -55 c to 155 c insulation voltage 1 min; u ins 75 v continuous 75 v
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 2 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 application information the power dissipation on the re sistor generates a tempe rature rise against the local ambi ent, depending on the heat flow support of the printed-circuit bo ard (thermal resistance). the ra ted dissipation applies only if the permitted film temperature is not exceeded. furthermore, a high level of ambient temperature or of po wer dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. these resistors do not feature a lifetime limitation when operated within the limi ts of rated dissipati on, permissible operatin g voltage and permissible film tempe rature. however, the resistance typically increases due to the resistors film temperature ov er operating time, generally known as drift. the drift may exceed th e stability requirements of an individual application circuit and thereby limits the functional lifetime. the designer may estimate the performance of the particular resistor application or set certain load and temperature limits in order to maintain a desired stability. the resistance value is influenced by the resistance of the terminations. the exact resistance value of the soldered part on th e pcb may deviate depending on e.g. solder quantity, pad layout, and soldering method . the resistance value of the unmounted part can be verified by a 4-point probe on the top side termination as shown below. fig. 1 maximum resistance change at rated dissipation operation mode standard power rated dissipation, p 70 0.2 w 0.25 w operating temperature range -55 c to 125 c -55 c to 155 c permissible film temperature, ? f max. 125 c 155 c max. resistance change at p 70 for resistance range, ? r/r after: 1 ? to 100 k ? 1 ? to 100 k ? 1000 h ? 0.1 % ? 0.2 % 8000 h ? 0.2 % ? 0.4 % 225 000 h ? 0.6 % - 600 m 870 m
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 3 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? products can be ordered us ing either the part number or product description. temperature coefficient and resistance range type / size tcr tolerance resistance e-series mcw 0406 at 25 ppm/k 0.1 % 1 ? to 100 k ? e24; e192 15 ppm/k 0.1 % 47 ? to 100 k ? e24; e192 packaging type / size code quantity carrier tape width pitch reel diameter mcw 0406 at p1 1000 tape and reel cardboard tape acc. iec 60286-3 type 1a 8 mm 4 mm 180 mm/7" p5 5000 pw 20 000 330 mm/13" part number and product description part number: mcw0406md4641bpw00 type / size version tcr resistance tolerance packaging mcw0406 m = at (automotive) e = 15 ppm/k d = 25 ppm/k 3 digit value 1 digit multiplier multiplier 8 = *10 -2 9 = *10 -1 0 = *10 0 1 = *10 1 2 = *10 2 3 = *10 3 b = 0.1 % p1 p5 pw product description: mcw 0406-25 0.1 % at pw 4k64 mcw 0406 -25 0.1 % at pw 4k64 type size tcr tolerance version packaging resistance mcw 0406 15 ppm/k 25 ppm/k 0.1 % at = automotive p1 p5 pw 4k64 = 4.64 k ? cw0406md4 m 41bpw 00 6
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 4 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 description production is strictly controlled and follows an extensive set of instructions established for reproducibility. a homogeneous film of special me tal alloy is deposited on a high grade ceramic substrate (al 2 o 3 ) and conditioned to achieve the desired temperature coefficient. specially designed inner contacts are deposited on both sides. a special laser is used to achiev e the target value by smoothly cutting a meander groove in the resistive layer without damaging the ceramics. the resistor elements are covered by a unique protective coating designed for electrical, mechanical and climatic protection. the terminations receive a final pure ti n on nickel plating. the result of the determined production is verified by an extensive testing procedure and optical inspection performed on 100 % of the indi vidual chip resistors. this includes full screening for the elimination of products with potential risk of early field failures (feasible for r ? 10 ? ). only accepted products are laid directly into the paper tape in accordance with iec 60286-3 type 1a (1) . assembly the resistors are suitable fo r processing on automatic smd assembly systems. they are suitable for automatic soldering using reflow or vapour phase as shown in iec 61760-1 (1) . the encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, es ters and aqueous solutions. the suitability of conformal coatings, potting compounds and their processes, if applie d, shall be qualified by appropriate means to ensure the long-term stability of the whole system. the resistors are rohs comp liant; the pure tin plating provides compatibility with lead (pb)-free and lead-containing soldering pr ocesses. solderability is specified for 2 years after produ ction or requalification. the permitted storage time is 20 years. the immunity of the plating against tin whisker growth has been proven by extensive testing. all products comply with the iec 62474 , material declaration for products of and for the electrotechnical industry. the dedicated database (2) , that list declarable substances, ensures full compliance with the following directives: ? 2000/53/ec end of life vehicle directive (elv) and annex ii (elv ii) ? 2011/65/eu restriction of the use of hazardous substances directive (rohs) ? 2012/19/eu waste electrical and electronic equipment directive (weee) approvals where applicable the resistors are tested within the iecq-cecc quality assessmen t system for electronic components to the detail specification en 140401-801 which refers to en 60115-1, en 140400 and the variety of environmental test procedures of the iec 60068 (1) series. the detail specification refers to the climatic category 55/125/56, which relates to the standard operation mode of this datasheet. vishay beyschlag has achieved approval of manufacturer in accordance with iecq 03-1 . the release certificate for technology approval schedule in accordance with cecc 240001 based on iecq 03-3-1 , is granted for the vishay beyschlag manufacturing process. related products for an alternative range of tcr and tolerance see the datasheet: ? professional wide terminal thin film chip resistors ( www.vishay.com/doc?28796 ) ? ? ? notes (1) the quoted iec standards are also released as en st andards with the same number and identical contents. (2) iec 62474 database can be found at http://std.iec.ch/iec62474 .
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 5 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 functional performance derating note ? for the permissible resistance change in each operation mode please refer to table maximum resistance change at rated dissipation, above. tests and requirements all tests are carried out in accordance with the following specifications: en 60115-1, generic specification en 60115-8 (successor of en 140400), sectional specification en 140401-801, detail specification iec 60068-2-xx, test methods the parameters stated in the test procedures and requirements table are based on the required tests and permitted limits of en 140401-801. the table presents only the most important tests, for th e full test schedule refer to the documents listed above. however, some additional tests and a number of improvements against those minimum requirements have been included. the testing also covers most of the requirements specified by eia / eca-703 and jis-c-5201-1. the tests are carried out under standard atmospheric conditions in accordance with iec 60068-1, 4.3, whereupon the following values are applied: temperature: 15 c to 35 c relative humidity: 45 % to 75 % air pressure: 86 kpa to 106 kpa (860 mbar to 1060 mbar). a climatic category lct / uct / 56 is applied, defined by the lower category temperature (lct), the upper category temperature (uct), and the du ration of exposure in the damp heat, steady st ate test (56 days). the components are mounted for testing on printed circuit boards in accordance with en 60115-8, 2.4.2, unless otherwise specified. ? 100 100 - 50 ambient temperature in c 175 standard mode power mode 155 0 20 40 60 80 125 power dissipation in % p 050 70
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 6 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 test procedures and requirements en 60115-1 clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability for product types: mcw 0406 at 1 ? to 100 k ? 4.5 - resistance - 0.1 % r 4.8.4.2 - temperature coefficient at (20 / -55 / 20) c and (20 / 155 / 20) c 15 ppm/k; 25 ppm/k 4.25.1 - endurance at 70 c: standard operation mode u = or u = u max. ; whichever is the less severe; 1.5 h on; 0.5 h off; 70 c; 1000 h 70 c; 8000 h (0.1 % r + 0.02 ? ) (0.2 % r + 0.02 ? ) endurance at 70 c: power operation mode u = or u = u max. ; whichever is the less severe; 1.5 h on; 0.5 h off; 70 c; 1000 h 70 c; 8000 h (0.2 % r + 0.02 ? ) (0.4 % r + 0.05 ? ) 4.25.3 - endurance at upper category temperature 125 c; 1000 h 155 c; 1000 h (0.15 % r + 0.02 ? ) (0.3 % r + 0.05 ? ) 4.24 78 (cab) damp heat, steady state (40 2) c; 56 days; (93 3) % rh (0.1 % r + 0.02 ? ) 4.39 67 (cy) damp heat, steady state, accelerated: standard operation mode (85 2) c (85 5) % rh u = ; u ??? 0.3 x u max. ; 1000 h (0.5 % r + 0.05 ? ) 4.23 climatic sequence: standard operation mode: (0.25 % r + 0.05 ? ) 4.23.2 2 (bb) dry heat uct; 16 h 4.23.3 30 (db) damp heat, cyclic 55 c; 24 h; ? 90 % rh; 1 cycle 4.23.4 1 cold lct; 2 h 4.23.5 13 (m) low air pressure 8.5 kpa; 2 h; (25 10) c 4.23.6 30 (db) damp heat, cyclic 55 c; 24 h; ? 9 0 % r h ; 5 cycles 4.23.7 - dc load u = ? u max. ; 1 min; lct = -55 c; uct = 125 c -1 (ab) storage at low temperature -55 c; 2 h (0.05 % r + 0.01 ? ) 4.19 14 (na) rapid change of temperature 30 min at lct and 30 min at uct; lct = -55 c; uct = 125 c; 1000 cycles (0.25 % r + 0.05 ? ) 4.13 - short time overload: standard operation mode u = 2.5 x ? 2 u max. ; whichever is the less severe; 5 s (0.05 % r + 0.01 ? ) p 70 x r p 70 x r 0.1 x p 70 x r p 70 x r p 70 x r
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 7 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) the quoted iec standards are also released as en st andards with the same number and identical contents. 4.27 - single pulse high voltage overload: standard operation mode severity no. 4: u = 10 x or u = 2 x u max. ; whichever is the less severe; 10 pulses 10 s/700 s to be determined 4.37 - periodic electric overload: standard operation mode u = or u = 2 x u max. whichever is the less severe; 0.1 s on; 2.5 s off; 1000 cycles to be determined 4.38 - electro static discharge (human body model) iec 61340-3-1 (1) ; 3 pos. + 3 neg. (equivalent to mil-std-883, method 3015) 500 v (0.5 % r + 0.05 ?? ) 4.22 6 (fc) vibration endurance by sweeping; 10 hz to 2000 hz; no resonance; amplitude ? 1.5 mm or ?? 200 m/s 2 ; 7.5 h (0.05 % r + 0.01 ?? ) no visible damage 4.17.2 58 (td) solderability solder bath method; snpb40; non-activated flux (215 3) c; (3 0.3) s good tinning ( ? 95 % covered); no visible damage solder bath method; snag3cu0.5 or snag3.5; non-activated flux; (235 3) c; (2 0.2) s good tinning ( ?? 95 % covered); no visible damage 4.18.2 58 (td) resistance to soldering heat solder bath method; (260 5) c; (10 1) s (0.1 % r + 0.02 ? ) no visible damage 4.29 45 (xa) component solvent resistance isopropyl alcohol +50 c; method 2 no visible damage 4.32 21 (ue 3 ) shear (adhesion) 9 n no visible damage 4.33 21 (ue 1 ) substrate bending depth 2 mm, 3 times (0.05 % r + 0.01 ?? ) no visible damage; no open circuit in bent position 4.7 - voltage proof u rms = u ins ; (60 5) s no flas hover or breakdown 4.35 - flammability needle flame test; 10 s no burning after 30 s test procedures and requirements en 60115-1 clause iec 60068-2 (1) test method test procedure requirements permissible change ( ? r ) stability for product types: mcw 0406 at 1 ? to 100 k ? p 70 x r 15 x p 70 x r
mcw 0406 at - precision www.vishay.com vishay beyschlag revision: 22-jan-15 8 document number: 28847 for technical questions, contact: thinfilmchip@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 dimensions solder pad dimensions note ? the rated dissipation applies only if the permitted film temperature is not exceeded. furthermore, a high level of ambient tem perature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board materials may be required to maintain the reliability of the assembly. specified power rati ng above 125 c requires dedicated heat-sink pads, which to a great extend depends on board materials and design. ? the given solder pad dimens ions reflect the considerations fo r board design and assembly as ou tlined e.g. in standards iec 6118 8-5-x, or in publication ipc-7351. they do not guarantee any supposed thermal properties, particularly as these are also strongly influen ced by many other parameters. ? still, the given solder pad dimensions will be found adequate for most general applications, e.g. those referring to standard operation mode. please note however that applications for power operat ion mode require special considerations for the design of solder pads and adjacent conductor areas. l t b h t t w w t dimensions and mass type h (mm) l (mm) w (mm) w t (mm) t t (mm) t b (mm) mass (mg) mcw 0406 at 0.3 0.05 1.0 0.15 1.5 0.15 > 75 % of w 0.2 + 0.1/- 0.15 0.2 0.1 1.9 recommended solder pad dimensions type reflow soldering g (mm) y (mm) x (mm) z (mm) mcw 0406 at 0.35 0.55 1.75 1.45 g x y z
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